Adhesives performance testing

Commercial glue bonding processes can be simulated in the laboratory assessment using the recently developed Pira adhesive performance tester (PAPT II). In particular, the performance of hot melt packaging adhesives can be studied without the need for disruptive production line trials.

The PAPT II has been designed to allow complete control over the key bonding process parameters of open time, contact time, glue application weight, contact pressure, adhesive temperature and application speed.

In addition the machine can measure the strength of the joint after multiple pre-set open and/or contact times, without the need to remove the test pieces from the instrument. Thus, the user is able to predict the compatibility of any combination of adhesive and substrate with a process application.

Adhesive bonds prepared using the PAPT II are subsequently tested for long term creep and heat resistance.

Expert Profile

  • Doug joined Pira in 1989 and has 20 years experience in the physical testing of packaging and packaging materials. He heads a team specialising in packaging and print related technical investigations. In 2004 Doug gained his postgraduate degree with distinction in Packaging Technology from Brunel University.

    Doug Leatherdale
    Doug Leatherdale

    Head of Physical Testing

    Pira International

    +44 1372 80 2108

See Also

  • Environmental Testing

    Further information on how Pira's Environmental Testing services can support your product development

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