Pinhole assessment
Pinholes in packaging films may result from the material conversion process or subsequent manual handling and transit of the primary packaging. Damage mechanisms include abrasion; flex cracking, snagging and puncture.
Pira can locate pinholes in flexible films using a range of vacuum, gas detection, optical, porosity and dye penetration techniques including those detailed in ritish and International standard BS EN 868-1 for which Pira is UKAS, ISO 17025 accredited.

The size of pinholes or micro-perforations can be determined either by optical microscopy or an aggregate hole-size determined for a pack using a pressure decay pack integrity method (see Pack integrity link right).